Veir Successfully Demonstrates Superconducting Power for Data Centers
First-gen technology delivers 10x more power within compact footprint.
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At at time when data centers are being built around the world and creating a stress on the current electrical grid, Veir, a Massachusetts-based superconducting power delivery solutions company, announced that its first-generation superconducting technology for AI racks (aka “STAR”) Demonstration has successfully delivered 3 megawatts of power via a single low voltage cable within a simulated and scalable data center environment. Following a $75M Series B funding round this past January, including investors like Munich Re Ventures, Microsoft's Climate Innovation Fund, and National Grid, this demonstration highlights the safe and effective use of Veir’s first-of-its-kind low-voltage superconductor cables to deliver power in and around AI factories and data centers, solving a critical bottleneck for the expanding data center market.
"The power bottleneck is the single biggest constraint for AI and data center growth," said Tim Heidel, CEO of VEIR. "This demonstration marks a major milestone for VEIR and the industry, proving that superconducting power technology can deliver the high-power levels needed in a data center environment, while dramatically reducing the space and weight demanded by traditional systems. Our technology is ready to deploy and provides an immediate solution needed to power the next generation of computing.”
According to the International Energy Agency, global data center electricity usage is projected to more than double over the next five years, reaching 945 TWh per year by 2030, with server racks alone requiring >500 kW per rack to support AI workloads. Conventional electrical infrastructure cannot meet these complex power and infrastructure needs, pushing traditional busbar and cable systems to their limits.
Leveraging its patented superconductivity technology, VEIR has pioneered a compact, high-power-density solution that operates with zero electrical resistance. Integrating a novel cooling system, the solution delivers up to 10 times greater power and covers more than 5 times the distance of conventional options, enabling smaller, more flexible data center footprints and faster deployment.
For more information, visit https://veir.com/.
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